| 摘要 |
<p>PURPOSE: An integrated circuit device and a manufacturing method thereof are provided to implement high integration of an integrated circuit device since an arrangement period of wire becomes shorter. CONSTITUTION: A plurality of wires(15) is arranged to be parallel each other. A contact via(16) is connected to each wire. A convex part is formed to protrude to connected to an arrangement direction in a part where is contacted to a contact via in each wire. A concave part is formed to be retreated to the arrangement direction in a part where is separated from the convex part in each wire. The convex part formed in one wire of neighboring two wires faces the concave part formed in the other wire of the neighboring two wires.</p> |
