发明名称 TRANSFER METHOD AND TRANSFER MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To suppress a level different at a matching part when a transfer sheet including a protective layer is transferred to a part to be transferred. <P>SOLUTION: In a transfer device 30, by moving a first movable die 82 and a second movable die 88 from an initial position to a transfer position, and holding a part on the side of the part 20 to be transferred of a matching part 24 of the transfer sheet 70 by a first holding surface 84 of the first movable die 82 and a second holding surface 90 of the second movable die 88, the matching part 24 is closely attached to the outer peripheral surface of the part 20 to be transferred. Thus, when transferring an ink layer and a clear layer to the part 20 to be transferred, formation of a gap between the matching part 24 and the part 20 to be transferred is suppressed. Thus, when the transfer sheet 70 including the clear layer is transferred to the part 20 to be transferred, the level difference in the matching part 24 is suppressed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012200952(A) 申请公布日期 2012.10.22
申请号 JP20110066441 申请日期 2011.03.24
申请人 TOKAI RIKA CO LTD 发明人 OHIRA HIROSHI
分类号 B44C1/17 主分类号 B44C1/17
代理机构 代理人
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