发明名称 MATERIAL FOR VAPOR DEPOSITION AND GAS BARRIER VAPOR DEPOSITION FILM, AND METHOD OF MANUFACTURING VAPOR DEPOSITION FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a gas barrier vapor deposition film that prevents an occurrence of splash phenomenon and has high gas barrier property. <P>SOLUTION: An inorganic oxide film 2 is formed on a polymer film base material 1 by depositing a vapor deposition material using a heating method, wherein the vapor deposition material includes metallic silicon, silicon dioxide, and metallic bismuth or bismuth oxide powder, the ratio äO/(Si+Bi)} of atomic number of oxygen to atomic number in total of silicon and bismuth is 1.0 to 1.8, and the ratio (Bi/Si) of atomic number of bismuth to that of silicon is 0.02 to 0.10. In the deposited film, the ratio äO/(Si+Bi)} of atomic number of oxygen to atomic number in total of silicon and bismuth is 1.6 to 1.9 and the ratio (Bi/Si) of atomic number of bismuth to that of silicon is 0.02 to 0.10. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012201938(A) 申请公布日期 2012.10.22
申请号 JP20110068604 申请日期 2011.03.25
申请人 TOPPAN PRINTING CO LTD 发明人 KUWAGATA YUSUKE;YOSHIHARA TOSHIAKI;HAYASHI JUNPEI
分类号 C23C14/24;B32B15/08 主分类号 C23C14/24
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