| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal-compression bonding method and thermal-compression bonding device which is excellent in the controllability of a timing to start the pressurization of an IC module, the pressure and pressurization time, and their profiles and temperature or the like and the positioning accuracy of the IC module and a card base material in the case of storing the IC module via a thermal-compression bonding sheet in the concave section of the card base material. <P>SOLUTION: Disclosed is a method of manufacturing an IC card including: placing an IC module via a thermal-compression bonding sheet in a predetermined concave section formed in a card base material; successively pressing the IC module from the upper part by each of a plurality of heads for press heated in a predetermined temperature; and lastly pressing and cooling the IC module by a press head for cooling in the predetermined temperature for adhering the IC module to the concave section, the method of manufacturing the IC card which being characterized such that the reciprocating motion of the plurality of heads for press and the press head for cooling is performed by a cam mechanism in which cam shafts are made common. <P>COPYRIGHT: (C)2013,JPO&INPIT |
