| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for slicing a wafer from a workpiece. <P>SOLUTION: The method for slicing the wafer from the workpiece (12) includes a step of forming the wafer by moving a wire section of a wire of a wire saw disposed in parallel to the workpiece during cutting, the wire section being tightly stretched between two wire guide rolls (1) provided with grooved coating (8) having a specific thickness. The method further includes a step of measuring a change of a coating length of one wire guide roll caused by a temperature change by measuring a distance between a sensor (7) and a ring (9), using the ring secured to the coating at an end of the coating; and a step of cooling the wire guide roll according to the measured distance. <P>COPYRIGHT: (C)2013,JPO&INPIT |
