BASE FILM, AND PRESSURE-SENSITIVE ADHESIVE SHEET PROVIDED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a base film and a pressure-sensitive adhesive sheet provided with the base film which protects a circuit surface of a bump-bearing wafer by using a surface protective sheet, at the same time, prevents bumps on the circuit surface from being crushed when grinding the rear surface and, moreover, suppresses the formation of dimples and cracks on the ground surface.

SOLUTION: The base film is a base film for the pressure-sensitive adhesive sheet to be bonded to a semiconductor wafer and is composed of: a layer (A) made of a cured material prepared by curing a formulation containing a polyether polyol urethane (meth)acrylate oligomer and an energy-ray curable monomer with energy rays; and a layer (B) made of a thermoplastic resin.

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