| 摘要 |
A light-emitting diode device. In one embodiment, the light-emitting device includes a heat-dissipating mount and a light-emitting diode chip. The heat-dissipating mount has a cavity, wherein the cavity includes an embedded portion and an inclined surface connected with the embedded portion. The light-emitting diode chip includes a substrate partly embedded into the embedded portion. A lower region of a side surface of the substrate has a first unsmooth surface, the first unsmooth surface has an exposed portion protruding above the embedded portion, and a bottom edge of the lower region is connected to a bottom surface of the substrate.
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