| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate capable of improving a yield of a manufacturing step. <P>SOLUTION: A manufacturing method of a ceramic multilayer substrate 1 having a ceramic substrate part 2 formed by burning a plurality of green sheets (a third green sheet 14, a first green sheet 15, a second green sheet 16, a fourth green sheet 17) and a chip-type electronic component 3 arranged inside the ceramic substrate part includes a lamination arrangement step of arranging the chip-type electronic component 3 on the first green sheet 15 and preparing a chip-type electronic component - green sheet laminate 12 in which the second green sheet 16 is arranged on the chip-type electronic component 3. A shrinkage factor when the first green sheet 15 is burnt differs from a shrinkage factor when the second green sheet 16 is burnt. <P>COPYRIGHT: (C)2013,JPO&INPIT |
