| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a board device which can prevent warpage of a board when a fin is fixed to the board or when a thermal load is generated. <P>SOLUTION: The board device comprises a first board 11 having one surface on which a first element 12 is mounted, a second board 13 arranged so that the one surface is in parallel with the other surface of the first board 11, a second element 14 which is mounted on the other surface of the second board 13, and a fin 15 being bonded to the other surface of the first board 11 and one surface of the second board 13. Even if a thermal load is generated in the first board 11 and the second board 13, stresses act on the first board 11 and the second board 13 to warp in a direction opposite to each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
