| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the generation of voids in assembly of a semiconductor device. <P>SOLUTION: A MCU chip 1 and an AFE chip 2 are mounted on a square-shaped die pad 3a having a pair of first sides 3aa, 3ab, and a pair of second sides 3ac, 3ad, a resin is supplied from the side of one second side 3ac out of two second sides 3ac, 3ad toward the side of the other second side 3ad after wire bonding is applied to the MCU chip 1 and the AFE chip 2, and a space between the chips is filled by passing the resin through an opening between a first pad group 1cc and a second pad group 1cd on the MCU chip 1, thereby suppressing the generation of the voids in a region between the chips. <P>COPYRIGHT: (C)2013,JPO&INPIT |
