发明名称 LED STRUCTURE AND MANUFACTURING METHOD THEREOF
摘要 The present invention discloses an LED structure and a manufacturing method thereof. The LED structure has a housing, an LED chip and a transparent encapsulant. The housing has a recess and at least one protruded wall. The LED chip is received in the recess. The transparent encapsulant is formed by dispensing a molding compound into the recess by an adhesive dispenser. The transparent encapsulant has an edge matched with an edge of the recess to encapsulate the LED chip in the recess, and has a height smaller than that of the protruded wall. The LED chip of the LED structure of the present invention can emit light through the spherical surface of the transparent encapsulant based on a greater visual angle, and thus enhance the light extraction efficiency.
申请公布号 US2012256213(A1) 申请公布日期 2012.10.11
申请号 US201113128102 申请日期 2011.04.14
申请人 CHANG KUANGYAO;HU CHECHANG;ZHANG JING;SHENZHEN CHINA STAR OPTOELECTONICS TECHNOLOGY CO., LTD. 发明人 CHANG KUANGYAO;HU CHECHANG;ZHANG JING
分类号 H01L33/50;H01L33/48 主分类号 H01L33/50
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