| 摘要 |
Providing a method for manufacturing a package capable of improving production efficiency. Providing a method for manufacturing a package including: a base board and a lid board which are bonded to each other; an accommodated article which is sealed in a cavity formed between the base board and the lid board; and a penetration electrode which is disposed in a penetration hole penetrating through the base board so as to electrically connect the accommodated article to the outside, the method including: a penetration hole forming step of forming a penetration hole for the penetration electrodes 30b, 30b in the base board; a penetration electrode alignment step of inserting a core portion 7 of a conductive rivet member 9 into the penetration hole of the base board; a glass frit filling step of applying a paste-like glass frit 6a onto the other surface of the base board and filling the glass frit into the penetration hole; and a baking step of baking and curing the glass frit, wherein the glass frit filling step involves forming a glass frit filling portion 41 having a larger diameter than the penetration hole and filling the glass frit also into the glass frit filling portion.
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