| 摘要 |
PURPOSE: An apparatus and method for polishing are provided to prevent a substrate from being bent by installing a support stage supporting a lower surface of the peripheral portion of the substrate. CONSTITUTION: A substrate holder(3) horizontally holds a substrate(W). The substrate holder includes a holding stage(4) holding a lower surface of the substrate by a vacuum suction, a hollow shaft(5) coupled to a central portion of the holding stage and a motor(M1) for rotating the hollow shaft. A polishing unit(25) polishes a peripheral portion of the substrate. The polishing unit is located in a polishing chamber(22). A polishing unit moving mechanism(30) includes a ball screw mechanism slidably holding an arm block, a motor for driving the ball screw mechanism and a power transmission mechanism. |
