METHOD FOR PREPARATION OF LIGHT EMITTING DIODE PACKAGE AND MOLDING FRAME FOR PREPARATION OF LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: A method for manufacturing a light emitting diode package and a molding frame for the same are provided to reduce manufacturing costs of a light emitting diode by omitting equipment such as a manufacturing device. CONSTITUTION: A molding frame(100) is formed on a substrate(110) using a heat-peelable adhesive sheet(111). A pressure sensitive adhesive layer is formed on one side of a base film. A heat-peelable adhesive layer is formed on other side of the base film. A lighting emitting chip is located on the substrate. A wire electrically connects the light emitting chip and a circuit unit formed on the substrate.