| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance the bonding reliability by suppressing occurrence of plastic deformation such as undulation and wrinkles on the surface of a circuit layer, and suppressing application of thermal stress onto the bonding interface of a ceramic substrate and the circuit layer, even when a thermal cycle load is applied. <P>SOLUTION: As a circuit layer 7, a clad material obtained by laminating two or more layers including a first layer 11 composing an electronic component mounting surface 7a where the purity of aluminum is 99.0-99.95 mass%, and a second layer 12 where the purity of aluminum is 99.99 mass% or higher is used, and the second layer 12 is bonded to a ceramic substrate by brazing. <P>COPYRIGHT: (C)2013,JPO&INPIT |
