| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser processing device which can form an altered layer along streets inside a wafer without the need for pasting dicing tape to the wafer surface. <P>SOLUTION: A laser processing device irradiates the area along plural streets formed on a surface with laser light to form an altered layer inside a wafer 10. This device comprises a chuck table 6 having a holding surface for a wafer pasted to an annular frame 11 which is loaded with a dicing tape 12, a light concentrator 72 of laser irradiation means which emits laser light in a wavelength having permeability for the wafer and dicing tape, and movement means which moves the chuck table and the light concentrator relative to each other. The wafer holding portion is formed with a transparent member, and the chuck table holds the wafer pasted to the dicing tape, with the holding surface of the wafer holding portion facing downward. The wafer is irradiated from an upper side of the wafer holding portion of the chuck table through the wafer holding portion and the dicing tape with the laser light. <P>COPYRIGHT: (C)2013,JPO&INPIT |
