| 摘要 |
<P>PROBLEM TO BE SOLVED: To cool a tray with high efficiency in a plasma processing apparatus which arranges the tray housing a substrate in a substrate housing hole on a substrate susceptor. <P>SOLUTION: Substrates 2 are housed in substrate housing holes 19A-19D which penetrate a tray 15 in the thickness direction. A dielectric plate 23 in a chamber 3 includes a tray supporting surface 28 which supports the lower surface 15c of the tray 15, and substrate mounting sections 29A-29D, in which electrostatic attracting electrodes 40, 202 and 204 is incorporated. When the tray 15 is placed on the tray supporting surface 28, the substrate 2 is placed on a substrate mounting surface 31, namely an upper end face of the substrate mounting sections 29A-29D. The substrate 2 is electrostatically attracted on the substrate mounting surface 31 by the electrostatic attracting electrodes 40 and 204 and the tray 15 is electrostatically attracted on the tray supporting surface 28 by the electrostatic attracting electrodes 202 and 204. The dielectric plate 23 is cooled by a refrigerant circulation device 61. <P>COPYRIGHT: (C)2013,JPO&INPIT |
