| 发明名称 |
FLAKED SILVER POWDER AND ITS PRODUCTION METHOD, AND CONDUCTIVE COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide flaked silver powder which is excellent in conductivity and adhesiveness to a body to be adhered, and can be reduced in cost, its production method and a conductive composition containing the flaked silver powder. <P>SOLUTION: In this flaked silver powder, a 50% particle diameter in a diffraction method is not smaller than 3 μm and not larger than 8 μm, apparent density is not lower than 0.25g/cm<SP POS="POST">3</SP>and not higher than 0.5g/cm<SP POS="POST">3</SP>, and a surface resistance value of a conductive membrane whose dry film thickness is 15 μm when containing 100 pts.wt. based on 100 pts.wt. of a polyester-system resin is not larger than 0.4 Ω/sq. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012188699(A) |
申请公布日期 |
2012.10.04 |
| 申请号 |
JP20110053218 |
申请日期 |
2011.03.10 |
| 申请人 |
TOYO INK SC HOLDINGS CO LTD;FUKUDA METAL FOIL & POWDER CO LTD |
发明人 |
NISHIYAMA YUJI;TOMINAGA HIROSHI;KOBAYASHI HIDENORI;NISHIDA MOTONORI;MATSUMOTO SEIICHI;SUGITANI YUSHI |
| 分类号 |
B22F1/00;B22F9/04;H01B1/22;H01B5/00;H01B5/02;H01B5/14;H01B13/00;H05K1/09;H05K3/12 |
主分类号 |
B22F1/00 |
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