发明名称 |
BONDING COMPOSITION AND BOARD |
摘要 |
<p>The purpose of the present invention is to provide a bonding composition having high adhesion, from which formaldehyde is not readily released. The present invention relates to a bonding composition cured by heating/compression. The bonding composition contains a polyvalent carboxylic acid.</p> |
申请公布号 |
WO2012133219(A1) |
申请公布日期 |
2012.10.04 |
申请号 |
WO2012JP57579 |
申请日期 |
2012.03.23 |
申请人 |
PANASONIC CORPORATION;SUGAWARA, RYO;UMEMURA, KENJI |
发明人 |
SUGAWARA, RYO;UMEMURA, KENJI |
分类号 |
C09J133/02;B27D1/04;B27N3/00;C09J11/06;C09J105/00;C09J135/00 |
主分类号 |
C09J133/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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