| 摘要 |
An imaging device includes a circuit board having a wiring line formed as part of an upper surface thereof; an electronic component mounted on the circuit board; a frame body mounted on the circuit board so as to surround the electronic component, and having connection electrodes formed on or above an upper surface thereof and external terminals formed on or above at least one of a side surface and a lower surface thereof which are electrically connected to the connection electrodes; an imaging element having a light-receiving section located in a central portion of an upper surface thereof, the imaging element being mounted on the upper surface of the frame body so as to cover an opening of the frame body; and a lens barrel having a lens, which is bonded to an outer periphery of the upper surface of the frame body so as to cover the imaging element. |
