| 发明名称 |
Power semiconductor module |
| 摘要 |
The present invention provides a power module in which a first semiconductor device disposed on a first substrate and a second semiconductor device disposed on a second substrate are disposed at symmetrical positions with a third substrate interposed therebetween.
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| 申请公布号 |
US8279605(B2) |
申请公布日期 |
2012.10.02 |
| 申请号 |
US20100877112 |
申请日期 |
2010.09.08 |
| 申请人 |
KAWANAMI YASUHIKO;ISOBE TASUKU;KABUSHIKI KAISHA YASKAWA DENKI |
发明人 |
KAWANAMI YASUHIKO;ISOBE TASUKU |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
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