发明名称 |
Head stack assembly with suspension tail bond alignment by solder pin |
摘要 |
A flexure tail of a head gimbal assembly (HGA) is aligned with a flex cable of a head stack assembly (HSA). At least one solder ball is adhered to a bond pad on the flex cable. The solder ball is entered into a first alignment hole in the flexure tail while the solder ball is solid. |
申请公布号 |
US8279560(B1) |
申请公布日期 |
2012.10.02 |
申请号 |
US20090397878 |
申请日期 |
2009.03.04 |
申请人 |
PAN TZONG-SHII;WESTERN DIGITAL TECHNOLOGIES, INC. |
发明人 |
PAN TZONG-SHII |
分类号 |
G11B5/48 |
主分类号 |
G11B5/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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