发明名称 Head stack assembly with suspension tail bond alignment by solder pin
摘要 A flexure tail of a head gimbal assembly (HGA) is aligned with a flex cable of a head stack assembly (HSA). At least one solder ball is adhered to a bond pad on the flex cable. The solder ball is entered into a first alignment hole in the flexure tail while the solder ball is solid.
申请公布号 US8279560(B1) 申请公布日期 2012.10.02
申请号 US20090397878 申请日期 2009.03.04
申请人 PAN TZONG-SHII;WESTERN DIGITAL TECHNOLOGIES, INC. 发明人 PAN TZONG-SHII
分类号 G11B5/48 主分类号 G11B5/48
代理机构 代理人
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