PURPOSE: A multi-chip package test system is provided to perform a test for a multi-chip package in which a plurality of semiconductor chips is mounted with one path. CONSTITUTION: A test head(210) is composed according to test conditions of a multi-chip package. The multi-chip package is mounted on a socket board(232). A base board(234) is connected to the test head. A wiring change unit(236) is arranged between the socket board and the base board. Electric wiring relation between a channel of a site board and a pin of the multi-chip package is changed. The site board is mounted on the test head. [Reference numerals] (220) Handler; (232) Socket board; (234) Base board; (236) Wiring change unit; (240) Control unit
