| 摘要 |
A METHOD (1100) AND AN APPARATUS FOR SEPARATING ELONGATED SEMICONDUCTOR STRIPS (352, 1242) FROM A WAFER (310) OF SEMICONDUCTOR MATERIAL ARE DISCLOSED. VACUUM IS APPLIED (1120) TO THE FACE OF EACH ELONGATED SEMICONDUCTOR STRIP (352, 1242) FORMING AN EDGE OF THE WAFER (310) OR BEING ADJACENT TO THE EDGE. THE WAFER (310) AND A SOURCE OF THE VACUUM (500, 3500, 3600, 4100) ARE DISPLACED (1130) TO SEPARATE EACH ELONGATED SEMICONDUCTOR STRIP (352, 1242) FROM THE WAFER (310). FURTHER, A METHOD (3200) AND AN APPARATUS FOR ASSEMBLING ELONGATED SEMICONDUCTOR STRIPS (352, 1242) SEPARATED FROM A WAFER (310) OF SEMICONDUCTOR MATERIAL INTO AN ARRAY OF THE STRIPS ARE DISCLOSED. STILL FURTHER, METHODS, APPARATUSES, AND SYSTEMS FOR ASSEMBLING AN ARRAY OF ELONGATED SEMICONDUCTOR STRIPS (352, 1242) ON A SUBSTRATE ARE DISCLOSED. |
