发明名称 POLYAMIDE COMPOSITION AND MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamide composition which excels in water absorption rigidity and rigidity when being heated, and is excellent in moldability at low temperature, and to provide a molding including the same. <P>SOLUTION: The polyamide composition includes: a polyamide copolymer having a dicarboxylic acid unit and a diamine unit; and at least one moldability-improving agent selected from the group consisting of a higher fatty acid, a metal salt of higher fatty acid, a higher fatty acid ester, and a higher fatty acid amide, wherein the dicarboxylic acid unit includes: an adipic acid unit; an isophthalic acid unit; and a 1,4-cyclohexanedicarboxylic acid unit, and in the polyamide copolymer, the content of the isophthalic acid unit is less than the content of the 1,4-cyclohexanedicarboxylic acid unit by the molar ratio. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012184305(A) 申请公布日期 2012.09.27
申请号 JP20110047579 申请日期 2011.03.04
申请人 ASAHI KASEI CHEMICALS CORP 发明人 SASAKI YUKIYOSHI;KURIHARA TETSUO
分类号 C08L77/06;C08G69/26 主分类号 C08L77/06
代理机构 代理人
主权项
地址