| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Pb-free solder paste for use at high temperatures which has strength required for the bonding of an electronic component to a substrate and which exhibits excellent wetting properties and excellent workability. <P>SOLUTION: The solder paste is obtained by mixing a solder alloy with a flux, wherein when the sum total of the solder alloy is taken as 100 mass%, the solder alloy contains 0.4 to 13.5 mass% of Zn, and contains 0.01 to 2.0 mass% of Cu and/or 0.03 to 0.7 mass% of Al, with the balance being Bi except for unavoidably contained impurities. <P>COPYRIGHT: (C)2012,JPO&INPIT |
