发明名称 VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
摘要 AbstractThe invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.
申请公布号 SG183365(A1) 申请公布日期 2012.09.27
申请号 SG20120060984 申请日期 2010.08.13
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 MORITA, KOUJI;MURAI, HIKARI;TAKANEZAWA, SHIN;INOUE, YASUO;SAKAI, KAZUNAGA
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