发明名称 |
VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD |
摘要 |
AbstractThe invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes. |
申请公布号 |
SG183365(A1) |
申请公布日期 |
2012.09.27 |
申请号 |
SG20120060984 |
申请日期 |
2010.08.13 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MORITA, KOUJI;MURAI, HIKARI;TAKANEZAWA, SHIN;INOUE, YASUO;SAKAI, KAZUNAGA |
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