发明名称 |
SEMICONDUCTOR APPARATUS, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS |
摘要 |
Disclosed herein is a semiconductor apparatus including: a first semiconductor part including a first wiring; a second semiconductor part which is adhered to the first semiconductor part and which includes a second wiring electrically connected to the first wiring; and a metallic oxide formed by a reaction between oxygen and a metallic material which reacts with oxygen more easily than hydrogen does, the metallic oxide having been diffused into a region which includes a joint interface between the first wiring and the second wiring and the inside of at least one of the first wiring and the second wiring.
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申请公布号 |
US2012241961(A1) |
申请公布日期 |
2012.09.27 |
申请号 |
US201213416412 |
申请日期 |
2012.03.09 |
申请人 |
KAGAWA YOSHIHISA;KOMAI NAOKI;SONY CORPORATION |
发明人 |
KAGAWA YOSHIHISA;KOMAI NAOKI |
分类号 |
H01L23/522;H01L21/768 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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