| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad capable of reducing the occurrence of polishing defects (scratches) while improving durability of the polishing pad during dressing in a CMP method. <P>SOLUTION: A composition according to the present invention is a composition for forming a polishing layer of a chemical mechanical polishing pad, and contains (A) polyisocyanate, (B) polyol and (C) a filler. The (C) filler has at least one functional group selected from the group consisting of -NH<SB POS="POST">2</SB>, -NH-, -N=C=O, -NHCONH<SB POS="POST">2</SB>, -COOH and -SH. <P>COPYRIGHT: (C)2012,JPO&INPIT |
