METHOD FOR FORMING ELECTRONIC CIRCUIT, ELECTRONIC CIRCUIT, AND COPPER-CLAD LAMINATED BOARD FOR FORMING ELECTRONIC CIRCUIT

摘要

In this method for forming an electronic circuit, a layer of a nickel-copper alloy containing 60 wt% or more nickel is formed as a surface treatment layer on an etching surface side of a copper layer formed from a rolled copper foil or electrolytic copper foil, and the surface on the side of this copper layer that is not etched is attached to a resin substrate to form a copper-clad laminated board. After forming a resist pattern for forming a circuit on the surface on which the surface treatment layer has been formed, an electronic circuit is formed by etching. The method for forming an electronic circuit is characterized by batch etching of the surface treatment layer and copper layer with the same etching solution and forming the electronic circuit on the resin substrate. During the formation of the circuit, sideways etching is suppressed, and not only is a high etch factor possible, but also a copper foil, a copper-clad laminated board for forming an electronic circuit, and an electronic circuit board using the same are provided such that a more uniform circuit can be formed with the intended circuit width, the etching properties for pattern etching are improved, and shorts and occurrences of failed circuit widths can be prevented even with batch etching of the surface treatment layer and copper foil without introducing a separate process for eliminating the surface treatment layer.