| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition for a semiconductor package, which has excellent molding processability such as transfer moldability, and has high light resistance and heat resistance. <P>SOLUTION: The curable resin composition for a light-emitting diode package provides a package including a curable resin composition containing, as essential components: (A) an organic compound containing at least two carbon-carbon double bonds, which are reactive with an SiH group, in a molecule; (B) a compound containing at least two SiH groups in a molecule; (C) a hydrosilylation catalyst; and (D) an inorganic filler. In the curable resin composition, the addition amount of the inorganic filler is 75-95 wt.% based on the total composition. The package has a plate shape for mounting a light-emitting diode element. The light-emitting diode has a light-emitting output of 5 mW or more at 20 mA. <P>COPYRIGHT: (C)2012,JPO&INPIT |
