发明名称 |
METHOD FOR WAFER DICING AND DRILLING THROUGH ANISOTROPIC ETCHING AFTER LOCAL AMORPHIZATION USING LASER BEAM |
摘要 |
PURPOSE: An anisotropic etching method and a dicing and drilling method using the same are provided to prevent the chipping of a wafer in the dicing and drilling operations. CONSTITUTION: A coating layer(20) is formed on one side of a wafer(10). The wafer is comprised of silicon or sapphire. The coating layer is eliminated by radiating laser. An establishment portion of the thickness of the wafer becomes amorphous material. A laser machining portion of the wafer is etched. The coating layer is one among a photosensitive polymer, a silicon nitride, and a silicon oxide.
|
申请公布号 |
KR20120102897(A) |
申请公布日期 |
2012.09.19 |
申请号 |
KR20110020782 |
申请日期 |
2011.03.09 |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
SHIN, DONG SIG;SUH, JEONG;CHOI, SANG KYU |
分类号 |
H01L21/78;H01L21/301 |
主分类号 |
H01L21/78 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|