| 摘要 |
According to one exemplary embodiment, a lead frame package includes a number of leads and a number of contacts, where each of the contacts is situated over one of the leads. The lead frame package further includes a semiconductor die including a number of bond pads. Each of the contacts is directly attached and bonded to one of the bond pads on the semiconductor die. Each of the contacts is situated over a top portion of one of the leads, where the top portion has a shorter length than a middle portion of each of the leads. Each of the contacts is connected to one of the bond pads on the semiconductor die without a wire bond. The semiconductor die does not include a redistribution layer situated over an active surface of the semiconductor die.
|
