发明名称 |
TREATMENT OF A SELF-ASSEMBLED MONOLAYER ON A DIELECTRIC LAYER FOR IMPROVED EPOXY ADHESION |
摘要 |
This disclosure provides systems, methods, and apparatus for treating a self-assembled monolayer coating on a dielectric layer to improve epoxy adhesion to the self-assembled monolayer coating. In implementations of the methods, a dielectric layer on a surface of a substrate is provided. A self-assembled monolayer coating is formed on the dielectric layer. A seal region of the self-assembled monolayer coating is selectively treated. A component is bonded to the seal region of the self-assembled monolayer coating with an epoxy. Implementations of the methods may be used to encapsulate an electromechanical systems device on the substrate with a cover using an epoxy. |
申请公布号 |
US2012229709(A1) |
申请公布日期 |
2012.09.13 |
申请号 |
US201113046558 |
申请日期 |
2011.03.11 |
申请人 |
QUALCOMM MEMS TECHNOLOGIES, INC. |
发明人 |
HEALD DAVID LESLIE;RAFANAN MAJORIO ARAFILES |
分类号 |
H04N5/66;B32B3/00;B32B27/38;B32B37/02;B32B37/06;B32B37/12;B32B37/14;B32B37/30;B32B38/00 |
主分类号 |
H04N5/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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