| 摘要 |
Non-contact testing devices formed on a printed circuit board (PCB), to enable testing high-speed signals propagating along at least one signal track located on a signal layer of the PCB, and methods of testing high-speed signals using thereof are provided. A non-contact testing device includes a non-contact testing track formed on a layer of the PCB, and having at least one portion substantially parallel with the at least one signal track and a testing point located at an end of the non-contact testing track.
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