发明名称 MEMS DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To easily manufacture an MEMS device that has structure, in which an electrode surface of a substrate side and an undersurface of a vibrating member oppose to each other with a sufficient narrow gap therebetween, and uses torsional vibration. <P>SOLUTION: A manufacturing method of an MEMS device comprising base materials, a floating structure and a raised opposing section that is detached and opposes with respect to a partial region of the floating structure includes: a step S1 for preparing an SOI substrate; a step S2 for forming the raised opposing section, a supporting beam section or the like by patterning a first silicon layer; a step S3 for removing a first region halfway in a thickness direction by etching; a step S4 for disconnecting between the raised opposing section and a second silicon layer by etching at least a part of an intermediate insulation layer; a step S5 for bonding the base materials to each other; and a step S6 for separating the raised opposing section from an outer frame section while forming the floating structure by patterning the second silicon layer. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012178710(A) 申请公布日期 2012.09.13
申请号 JP20110040473 申请日期 2011.02.25
申请人 SANYO ELECTRIC CO LTD;RITSUMEIKAN 发明人 SUZUKI KENICHIRO;KYO MASAYA
分类号 H03H3/007;B81B3/00;B81C1/00;H03H9/24 主分类号 H03H3/007
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