摘要 |
Disclosed is a method for producing a terminal for an electronic component, which enables the production of a terminal for an electronic component wherein a lead-free tin-plated lead terminal part and an electrode terminal part that is formed from aluminum are bonded together with excellent bonding strength. Specifically disclosed is a method for producing a terminal for an electronic component, said terminal being obtained by bonding a lead-free tin-plated lead terminal part with an electrode terminal part that is formed from aluminum. In the method, the lead terminal part and the electrode terminal part are arranged at a distance, and a voltage is applied between the lead terminal part and the electrode terminal part, thereby generating a plasma. Then, while melting or semi-melting the lead-free tin plating by the plasma, one end of the lead terminal part and the axial core of the electrode terminal part are pressed together and percussion welded. |