发明名称 |
Integrated circuit packaging system with encapsulated via and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; attaching a buffer interconnect to and over the substrate; forming an encapsulation over the substrate covering the buffer interconnect and the integrated circuit; and forming a via in the encapsulation and to the buffer interconnect.
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申请公布号 |
US8264091(B2) |
申请公布日期 |
2012.09.11 |
申请号 |
US20090563514 |
申请日期 |
2009.09.21 |
申请人 |
CHO NAMJU;CHI HEEJO;SHIN HANGIL;STATS CHIPPAC LTD. |
发明人 |
CHO NAMJU;CHI HEEJO;SHIN HANGIL |
分类号 |
H01L23/28;H01L21/44 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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