| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide electronic component and module in which fracture can be prevented at the bonding portion of a bump and an element by increasing the bonding area even of bumps or columnar electrodes formed at a narrow pitch. <P>SOLUTION: A bump 15 to be formed on the pad 12 of an element 11 is formed so that the bump protrudes from the pad 12 in the length direction thereof. Consequently, bonding area of the bump can be increased and fracture of the bump due to thermal stress can be suppressed during the packaging. Since adjoining bumps do not protrude in the lateral direction, fracture of the bump due to thermal stress can be suppressed during the packaging, and since the distance between adjoining bumps can be ensured, short circuit of the bumps can be prevented. <P>COPYRIGHT: (C)2012,JPO&INPIT |
