| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component measuring apparatus with which a large-current test can be performed even for an electronic component in which a contact area with a lead part cannot be secured sufficiently. <P>SOLUTION: An electronic component measuring apparatus 1 measures characteristics of an electronic component S from which a plurality of lead parts S1 are protruded and in which a metal plate S2 wider than the lead parts S1 is deposited to the bottom surface and at least one lead part S1a is connected with the metal plate S2. The electronic component measuring apparatus 1 includes a hold pin 6 on which such an electronic component S is placed, contacts 21 and 22 in contact with the respective lead parts S1, and a metal plate contact 22b wider than the contacts 21 and 22. The metal plate contact 22b is brought into contact with the metal plate S2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
