| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mold clamping device that maintains parallelism between a fixed platen and a movable platen during mold clamping with a relatively simple structure. <P>SOLUTION: The mold clamping device includes: a base 12, a fixed platen 15 on which a fixed die 19 is mounted, a pressure receiving platen 18 connected to the fixed platen 15 by a plurality of tie bars 20, a movable platen 21 arranged between the fixed platen 15 and the pressure receiving platen 18 and on which a movable die 22 is mounted, and a mold clamping mechanism 37 for mold-clamping the fixed die 19 and the movable die 22. An angle adjusting mechanism 40 is arranged in the pressure receiving platen 18, which allows the angle of the platen in a vertical and horizontal directions to be changed with respect to a surface C orthogonal to an axis B in mold opening/closing directions. <P>COPYRIGHT: (C)2012,JPO&INPIT |
