| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem of a conventional electronic device that a cooling path of a semiconductor package disposed between wiring boards is not secured without increasing the device size when the wiring boards are stacked. <P>SOLUTION: An electronic device includes: a semiconductor package 1 that is a heat generation source; a first wiring board 2 on which the semiconductor package 1 is mounted; a second wiring board 3 disposed so as to be spaced a predetermined distance away from a surface of the first wiring board 2 where the semiconductor package 1 is mounted and having one or multiple through holes 3d; a heat transfer member 4 disposed between the through holes 3d of the second wiring board 3 and the semiconductor package 1 and transmitting heat from the semiconductor package 1 to the through holes 3d; and heat radiation means 5 bonded to a surface of the second wiring board 3 that is the opposite side of the heat transfer member 4 so that heat is transmitted from the through holes 3d thereto and radiating the transmitted heat to the exterior. <P>COPYRIGHT: (C)2012,JPO&INPIT |
