发明名称 CONDUCTIVE RESIN MOLDED BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide a carbon fiber-reinforced polyolefinic resin molded body excellent in conductivity. <P>SOLUTION: The conductive resin molded body contains, with respect to 100 wt.% of the whole composition, (A) 10 to 40 wt.% of a carbon fiber having an average fiber diameter of 1 to 20 &mu;m and a weight-average fiber length in a molded article of 0.3 to 10 mm, (B) 0.1 to 20 wt.% of an antistatic agent, (C) 0.1 to 5 wt.% of a conductive filler other than (A), and (D) 35 to 79.8 wt.% of a polyolefinic resin. The molded body has a volume resistivity of &le;0.1 &Omega;cm. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012167251(A) 申请公布日期 2012.09.06
申请号 JP20110287774 申请日期 2011.12.28
申请人 TORAY IND INC 发明人 MITSUTSUJI YUKI;MORIYAMA MASAHIRO;MIYOSHI KATSUHIRO;NISHIMURA TORU
分类号 C08J5/00;C08K3/04;C08K7/06;C08L23/00;C08L23/10;C08L23/28;C08L101/12 主分类号 C08J5/00
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