| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-foiled laminate and an adhesive coated metal foil that can give a printed circuit board where components can be mounted with a higher efficiency than that of the prior art. SOLUTION: A metal-foiled laminate 300 comprises a substrate 30 obtained by heating and pressing a prepreg having a fiber base and a thermosetting resin composition impregnated therein, and a metal foil 10 formed in contact with the substrate 30, wherein a surface side of the substrate 30 of the metal foil 10 has Rz≤2.5μm, the thickness of the fiber base is≤50μm, and the light transmittance is≥20% at 650-830 nm of the substrate 30. COPYRIGHT: (C)2008,JPO&INPIT |
