发明名称 MULTILAYER MOLDING APPARATUS AND INJECTION MOLDING METHOD
摘要 A multilayer molding apparatus, comprising: a fixed platen; a movable platen; an intermediate platen positioned between the fixed platen and the movable platen to be movable in the direction to come close or be opened, and having a surface facing the fixed platen, a surface facing the movable platen, and a housing space that goes therethrough from the surface facing the fixed platen to the surface facing the movable platen; and a rotary platen rotatably supported by the intermediate platen inside the housing space of the intermediate platen, and having at least one pair of parallel surfaces facing the fixed platen and the movable platen, wherein at least one of the surfaces of the intermediate platen facing the fixed platen and the movable platen is a mold mounting surface on which a mold can be mounted directly or indirectly.
申请公布号 US2012219655(A1) 申请公布日期 2012.08.30
申请号 US201213398407 申请日期 2012.02.16
申请人 OKAMOTO AKIO;MIYAMOTO KAZUAKI;IWAMOTO TOSHIKAZU;SHINADA ATSUSHI;OTA ETSUJI;UBE MACHINERY CORPORATION, LTD. 发明人 OKAMOTO AKIO;MIYAMOTO KAZUAKI;IWAMOTO TOSHIKAZU;SHINADA ATSUSHI;OTA ETSUJI
分类号 B28B17/00 主分类号 B28B17/00
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