| 摘要 |
Random defects and repeaters accommodated on a wafer are detected using slice information obtained by scanning a plurality of wafer slices; analyzing defect information using a first set of filters selected to detect random defects, thereby generating a first set of defects per slice, analyzing the defect information using a second set of filters selected to detect repeaters, thereby providing a second set of defects per slice; analyzing a plurality of the second sets of defects per slice using a third set of filters selected to detect repeater families, thereby providing a set of repeaters per wafer; and optionally combining the set of repeaters per wafer with a plurality of the first sets of defects per slice, thereby generating one or more defect maps indicative of random defects and/or repeaters. |
