Chip stack package and method for manufacturing the same,申请号KR20100096609-传众专利搜索

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发明名称	Chip stack package and method for manufacturing the same
摘要
申请公布号	KR101176349(B1)	申请公布日期	2012.08.24
申请号	KR20100096609	申请日期	2010.10.05
申请人		发明人
分类号	H01L23/48;H01L21/60	主分类号	H01L23/48
代理机构		代理人
主权项
地址

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