发明名称 |
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING METAL BUMP |
摘要 |
A method of manufacturing a printed circuit board, including: providing a metal layer; forming an insulation layer on the metal layer and then forming via holes for exposing the metal layer in the insulation layer; forming vias charged in the via holes and a circuit layer on the insulation layer; and forming metal bumps at ends of the vias. |
申请公布号 |
US2012211464(A1) |
申请公布日期 |
2012.08.23 |
申请号 |
US201213457792 |
申请日期 |
2012.04.27 |
申请人 |
AN JIN YONG;KIM KI HWAN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
AN JIN YONG;KIM KI HWAN |
分类号 |
H05K3/00;C23F1/02 |
主分类号 |
H05K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|