发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition facilitating control of a developing solution or a stripping solution and having excellent dispersibility in a developing solution. <P>SOLUTION: There is provided a photosensitive resin composition comprising: (a) an alkali-soluble thermoplastic polymer of 20 to 90 mass%; (b) an addition polymerizable monomer having at least one polymerizable ethylenically unsaturated bond in a molecule of 5 to 75 mass%; (c) a photopolymerization initiator of 0.01 to 30 mass% and (d) a compound represented by general formula [I]:R<SB POS="POST">1</SB>-O-(A<SB POS="POST">1</SB>-O)<SB POS="POST">n1</SB>-H of 0.01 to 30 mass%. In the formula, R1 represents a monovalent organic group having 1 to 8 carbon atoms; A<SB POS="POST">1</SB>represents an alkylene group; n1 represents an integer of 1 or more and 60 or less; and the repeated structure of -(A<SB POS="POST">1</SB>-O)- may be the same or different, and when the repeated structure of -(A<SB POS="POST">1</SB>-O)- is different from one another, the structure may be a random or block structure. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012159651(A) 申请公布日期 2012.08.23
申请号 JP20110018702 申请日期 2011.01.31
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 FUJIWARA AKIRA;IDE YOICHIRO
分类号 G03F7/004;G03F7/027;G03F7/033;H05K3/06;H05K3/18 主分类号 G03F7/004
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