SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve production yield and reliability by controlling deformation of a substrate or a chip. CONSTITUTION: A first chip(202) is laminated on a substrate(100) by the medium of an adhesive tape. A second chip(204) is laminated on the first chip by the medium of a penetrated wafer backside lamination tape. The penetrated wafer backside lamination tape protects the upper side and a part of the side of the first chip. A first bonding wire(402) interlinks a substrate pad of the substrate and a first chip pad of the first chip. A second bonding wire(404) interlinks the first chip pad of the first chip and a second chip pad of the second chip.